Описание материалов:
        
            FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications.
Suggested Applications:
Honeycomb sandwich construction
Metallic bonding
Non-metallic bonding
        
     
    
    
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| Характеристики  |  | 
| Используется  |  | 
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| Формы  |  | 
| Механические | Номинальное значение | Единица измерения |  | 
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| Прочность на растяжение 1 |  |  |   | 
|     24°C  | 6.14 | MPa |   | 
|     177°C  | 4.59 | MPa |   | 
| Прочность сдвига  |  |  |   | 
|     24°C 2 | 24.3 | MPa |   | 
|     24°C 3 | 24.8 | MPa |   | 
| Примечание | 
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| 1 . | Flatwise tensile, FM 57 film adhesive sandwich bonding | 
| 2 . | FM 57 film adhesive on composite substrate | 
| 3 . | FM 57 film adhesive on titanium substrate |